Cookies
We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
IEC 60749-21-ed.3.0
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Translate name
STANDARD published on 9.12.2025
The information about the standard:
Designation standards: IEC 60749-21-ed.3.0
Publication date standards: 9.12.2025
SKU: NS-1252468
The number of pages: 41
Approximate weight : 123 g (0.27 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60749-21-ed.3.0 :
IEC 60749-21:2025 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for “dip and look” solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing. This test is considered destructive unless otherwise detailed in the relevant specification. NOTE 1 This test method does not assess the effect of thermal stresses which can occur during the soldering process. More details can be found in IEC 60749-15 or IEC 60749-20. NOTE 2 If a qualitative test method is preferred, the Wetting balance test method can be found in IEC 60068-2-69. This edition includes the following significant technical changes with respect to the previous edition: - revision to certain operating conditions in line with current working practices. L’IEC 60749-21:2025 etablit une procedure normalisee pour determiner la brasabilite des connexions de sortie des boitiers de dispositifs qui sont destinees a etre fixees sur une autre surface en utilisant de la brasure etain-plomb (SnPb) ou sans plomb pour realiser cette fixation. Cette methode d’essai decrit une procedure pour les essais de brasabilite par "immersion et examen visuel" des composants pour montage en surface (CMS), par trous traversants et axial, ainsi qu’une procedure facultative d’essai de brasabilite pour des CMS pour montage en surface sur carte, afin de permettre la simulation du processus de brasage devant etre utilise dans l’application du dispositif. La methode d’essai fournit egalement des conditions optionnelles pour le vieillissement. Cet essai est considere comme destructif, sauf indication contraire dans la specification applicable. NOTE 1 Cette methode d’essai nevalue pas l’effet des contraintes thermiques qui peuvent se produire pendant la procedure de brasage. De plus amples details sont fournis dans l’IEC 60749-15 ou l’IEC 60749-20. NOTE 2 Si la preference est donnee a une methode dessai qualitative, la methode dessai de la balance de mouillage peut etre consultee dans lIEC 60068-2-69. Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: - revision de certaines conditions de fonctionnement en rapport avec les pratiques de travail actuelles.
We recommend:
Technical standards updating
Do you want to make sure you use only the valid technical standards?
We can offer you a solution which will provide you a monthly overview concerning the updating of standards which you use.
Would you like to know more? Look at this page.
