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Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
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STANDARD published on 9.12.2025
Designation standards: IEC 60749-23-ed.2.0
Publication date standards: 9.12.2025
SKU: NS-1252470
The number of pages: 19
Approximate weight : 57 g (0.13 lbs)
Country: International technical standard
Category: Technical standards IEC
IEC 60749-23:2025 specifies the test used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as "burn-in", can be used to screen for infant-mortality related failures. The detailed use and application of burn-in is outside the scope of this document. This edition includes the following significant technical changes with respect to the previous edition: a) absolute stress test definitions and resultant test durations have been updated. LIEC 60749-23:2025 specifie lessai utilise pour determiner les effets dans le temps des conditions de polarisation et de temperature sur des dispositifs a etat solide. Il simule les conditions de fonctionnement des dispositifs d’une maniere acceleree et il est essentiellement utilise pour la qualification et le controle de fiabilite. Une forme de duree de vie utilisant une temperature elevee avec polarisation sur une courte duree, generalement connue sous le nom de "rodage", peut etre utilisee pour depister les defaillances liees a la mortalite infantile. L’utilisation detaillee et l’application du rodage ne font pas partie du domaine d’application du present document. Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: a) les definitions des essais de contraintes absolues et les durees dessai qui en resultent ont ete mises a jour.
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