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IEC 60749-3-ed.2.0
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
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STANDARD published on 3.3.2017
The information about the standard:
Designation standards: IEC 60749-3-ed.2.0
Publication date standards: 3.3.2017
SKU: NS-677380
The number of pages: 11
Approximate weight : 33 g (0.07 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60749-3-ed.2.0 :
IEC 60749-3:2017 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance. This edition includes the following significant technical changes with respect to the previous edition: a) reference to the need for ESD protection; b) inclusion of information on the phenomenon of tin whiskers; c) inclusion of an optional report form/checklist. L’IEC 60749-3:2017 a pour but de verifier que les materiaux, la conception, la construction, les marquages et l’execution du dispositif a semiconducteurs sont conformes au document d’approvisionnement applicable. L’examen visuel externe est un essai non destructif et il s’applique a tous les types de boitiers. Cet essai est utile pour la qualification, la surveillance des procedes ou pour la reception des lots. Cette edition inclut les modifications techniques majeures suivantes par rapport a l’edition precedente: a) reference a la necessite d’une protection contre les decharges electrostatiques; b) inclusion d’informations sur le phenomene de trichite d’etain; c) inclusion d’un formulaire/d’une liste de controle facultatif, a des fins de rapport.
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