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IEC 60749-30-ed.2.0-RLV
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
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STANDARD published on 17.8.2020
The information about the standard:
Designation standards: IEC 60749-30-ed.2.0-RLV
Publication date standards: 17.8.2020
SKU: NS-1094758
The number of pages: 41
Approximate weight : 123 g (0.27 lbs)
Country: International technical standard
Category: Technical standards IEC
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Annotation of standard text IEC 60749-30-ed.2.0-RLV :
IEC 60749-30:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition: - inclusion of new Clause 3; - expansion of 6.7 on solder reflow; - inclusion of explanatory notes and clarifications.
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