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IEC 60749-34-1-ed.1.0
Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
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STANDARD published on 20.6.2025
The information about the standard:
Designation standards: IEC 60749-34-1-ed.1.0
Publication date standards: 20.6.2025
SKU: NS-1225191
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60749-34-1-ed.1.0 :
IEC 60749-34-1:2025 describes a test method that is used to determine the capability of power semiconductor modules to withstand thermal and mechanical stress resulting from cycling the power dissipation of the internal semiconductors and the internal connectors. It is based on IEC 60749-34, but is developed specifically for power semiconductor module products, including insulated-gate bipolar transistor (IGBT), metal-oxide-semiconductor field-effect transistor (MOSFET), diode and thyristor. If there is a customer request for an individual use or an application specific guideline (for example ECPE Guideline AQG 324), details of the test method can be based on these requirements if they deviate from the content of this document. This test caused wear-out and is considered destructive. L’IEC 60749-34-1:2025 decrit une methode d’essai utilisee pour determiner la capacite des modules de puissance a semiconducteurs a resister aux contraintes thermiques et mecaniques du fait du cyclage de la dissipation de puissance des semiconducteurs internes et des connecteurs internes. Elle est basee sur l’IEC 60749-34, mais est developpee specifiquement pour les modules de puissance a semiconducteurs, y compris les transistors bipolaires a grille isolee (IGBT), les transistors a effet de champ a structure metal-oxyde-semiconducteur (MOSFET), les diodes et les thyristors. En cas de demande d’un client pour une utilisation individuelle ou une ligne directrice specifique a une application (par exemple la ligne directrice AQG 324 de l’ECPE), les details de la methode d’essai peuvent etre bases sur ces exigences s’ils s’ecartent du contenu du present document. Cet essai provoque une usure et est considere comme destructif.
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