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IEC 60749-35-ed.1.0
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
STANDARD published on 18.7.2006
The information about the standard:
Designation standards: IEC 60749-35-ed.1.0
Publication date standards: 18.7.2006
SKU: NS-411409
The number of pages: 43
Approximate weight : 129 g (0.28 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60749-35-ed.1.0 :
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages. La presente partie de la CEI 60749 definit les procedures pour realiser la microscopie acoustique pour composants electroniques a boitier plastique. Cette norme fournit un guide d utilisation de la microscopie acoustique pour detecter les anomalies (decollement interlaminaire, fissures, vides dans le compose de moulage) de maniere reproductible et non destructive dans des boitiers en plastique.
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