Standard IEC 60749-37-ed.2.0 12.10.2022 preview

IEC 60749-37-ed.2.0

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

Translate name

STANDARD published on 12.10.2022


Language
Format
AvailabilityIN STOCK
Price250.20 USD excl. VAT
250.20 USD

The information about the standard:

Designation standards: IEC 60749-37-ed.2.0
Publication date standards: 12.10.2022
SKU: NS-1094761
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC

The category - similar standards:

Semiconductor devices in general

Annotation of standard text IEC 60749-37-ed.2.0 :

IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition: - correction of a previous technical error concerning test conditions; - updates to reflect improvements in technology. L’IEC 60749-37:2022 fournit une methode d’essai destinee a evaluer et comparer la performance de chute des composants electroniques a montage en surface dans des applications de produits electroniques portatifs dans un environnement d’essai accelere, ou une flexion excessive d’une carte de circuit imprime provoque une defaillance de produit. Le but est de normaliser la carte dessai et la methodologie dessai pour fournir une evaluation reproductible de la performance dessai de chute des composants a montage en surface, en reproduisant les memes modes de defaillances que ceux observes normalement au cours dun essai au niveau du produit. Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: - correction d’une erreur technique precedente concernant les conditions d’essai; - mises a jour afin de refleter les progres technologiques.

We recommend:

Technical standards updating

Do you want to make sure you use only the valid technical standards?
We can offer you a solution which will provide you a monthly overview concerning the updating of standards which you use.

Would you like to know more? Look at this page.




Cookies Cookies

We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.

You can refuse consent here.

Here you can customize your cookie settings according to your preferences.

We need your consent to use the individual data so that you can see information about your interests, among other things.