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Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
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STANDARD published on 29.11.2021
Designation standards: IEC 60749-39-ed.2.0-RLV
Publication date standards: 29.11.2021
SKU: NS-1094762
The number of pages: 38
Approximate weight : 114 g (0.25 lbs)
Country: International technical standard
Category: Technical standards IEC
IEC 60749-39:2021 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60749-39:2021 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow. This edition includes the following significant technical changes with respect to the previous edition: - updated procedure for "dry weight" determination.
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Latest update: 2026-01-28 (Number of items: 2 257 539)
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