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IEC 60749-42-ed.1.0
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
STANDARD published on 12.8.2014
The information about the standard:
Designation standards: IEC 60749-42-ed.1.0
Publication date standards: 12.8.2014
SKU: NS-411417
The number of pages: 16
Approximate weight : 48 g (0.11 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60749-42-ed.1.0 :
IEC 60749-42:2014 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests. LIEC 60749-42:2014 decrit une methode dessai pour evaluer lendurance des dispositifs a semiconducteurs utilises dans les environnements a temperature elevee et a forte humidite. Cette methode dessai est utilisee pour evaluer la resistance a la corrosion des interconnexions metalliques des puces des dispositifs a semiconducteurs sous boitiers moules en plastique ou contenus dans dautres types de boitiers. Elle est aussi utilisee comme moyen pour accelerer le phenomene de fuite du a la penetration dhumidite a travers le film de passivation et comme preconditionnement en vue de differents types dessais.
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