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IEC 60749-5-ed.3.0-RLV
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
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STANDARD published on 19.12.2023
The information about the standard:
Designation standards: IEC 60749-5-ed.3.0-RLV
Publication date standards: 19.12.2023
SKU: NS-1161833
The number of pages: 26
Approximate weight : 78 g (0.17 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60749-5-ed.3.0-RLV :
IEC 60749-5:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment; c) replacement of references to “virtual junction” with “die”.
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