Standard IEC 60749-7-ed.3.0 27.11.2025 preview

IEC 60749-7-ed.3.0

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases

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STANDARD published on 27.11.2025


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The information about the standard:

Designation standards: IEC 60749-7-ed.3.0
Publication date standards: 27.11.2025
SKU: NS-1249231
The number of pages: 12
Approximate weight : 36 g (0.08 lbs)
Country: International technical standard
Category: Technical standards IEC

The category - similar standards:

Semiconductor devices in general

Annotation of standard text IEC 60749-7-ed.3.0 :

IEC 60749-7:2025 specifies the testing and measurement of water vapour and other gas content of the atmosphere inside a metal or ceramic hermetically sealed device. The test is used as a measure of the quality of the sealing process and to provide information about the long-term chemical stability of the atmosphere inside the package. It is applicable to semiconductor devices sealed in such a manner but generally only used for high reliability applications such as military or aerospace. Of particular interest is the measurement of the primary sealing gases (or lack thereof), the moisture content, the presence of bombing gases that are indicative of non-hermeticity (e.g. helium), oxygen to argon ratio indicative of room air ~ 20 to 1 (± 10 %), dissimilar concentration of internally sealed gases (e.g. nitrogen, helium) than originally sealed in the device package, the presence of leak test fluid (i.e. fluorocarbon, helium, air), and all other gases to determine if the device meets the specified moisture, hermeticity and other criteria. Also of interest is the measurement of all the other gases since they reflect upon the quality of the sealing process and provide information about the long-term chemical stability of the atmosphere inside the device. The presence of leak test fluorocarbon vapour in the internal gas analysis (IGA) is an indication of failure to meet leak test requirements of IEC 60749-8. This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: a) This document has been re-written and rearranged to align with the text of MIL-STD-883, Method 1018.10. b) Additional detail has been provided in the calibration requirements. L’IEC 60749-7:2025 specifie les essais et les mesures de la teneur en vapeur deau et en autres gaz de latmosphere a linterieur dun dispositif metallique ou ceramique scelle hermetiquement. Lessai vise a mesurer la qualite du procede de scellement et a donner des informations relatives a la stabilite chimique a long terme de latmosphere a linterieur du boitier. Il est applicable a tous les dispositifs a semiconducteurs scelles de cette maniere, mais generalement reserves pour les applications a haute fiabilite comme dans les domaines militaire et spatial. Le mesurage des principaux gaz detancheite (ou de leur absence), de la teneur en humidite, de la presence de gaz de bombardement revelatrice de labsence dhermeticite (lhelium, par exemple), du rapport oxygene/argon revelateur dun air ambiant denviron 20:1 (± 10 %), de la concentration differente de gaz scelle en interne (lazote ou lhelium, par exemple) par rapport a celui dorigine scelle dans le boitier du dispositif, de la presence dune fuite de liquide dessai (cest-a-dire le fluorocarbure, lhelium, lair) et de tous les autres gaz permettant de determiner si le dispositif satisfait aux criteres specifies en matiere dhumidite, dhermeticite, etc., presente un interet particulier. Le mesurage de tous les autres gaz refletant la qualite du procede de scellement et donnant des informations relatives a la stabilite chimique a long terme de latmosphere a linterieur du dispositif presente egalement un interet. La presence dune fuite de vapeur de fluorocarbure dessai dans lanalyse des gaz internes (IGA, Internal Gas Analysis) est revelatrice dune defaillance a satisfaire aux exigences dessai de fuite de lIEC 60749-8. Cet essai est destructif. Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: a) Le present document a ete remanie et reorganise de maniere a laligner sur le texte de la MIL-STD-883, methode 1018.10. b) Des details supplementaires ont ete fournis dans les exigences detalonnage.

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