We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
STANDARD published on 30.8.2002
Designation standards: IEC 60749-8-ed.1.0
Publication date standards: 30.8.2002
SKU: NS-411424
The number of pages: 31
Approximate weight : 93 g (0.21 lbs)
Country: International technical standard
Category: Technical standards IEC
Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices. The contents of the corrigenda of April 2003 and August 2003 have been included in this copy. Applicable aux dispositifs a semiconducteurs (dispo-sitifs discrets et circuits integres), determine le taux de fuite des dispositifs a semiconducteurs. Le contenu des corrigenda davril 2003 et daout 2003 a ete pris en consideration dans cet exemplaire.
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
(Corrigendum 1 - Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 8: Etancheite)
Correction published on 23.4.2003
Selected format:
Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
(Corrigendum 2 - Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 8: Etancheite)
Correction published on 12.8.2003
Selected format:
Do you want to be sure about the validity of used regulations?
We offer you a solution so that you could use valid and updated legislative regulations.
Would you like to get more information? Look at this page.
Latest update: 2026-01-28 (Number of items: 2 257 539)
© Copyright 2026 NORMSERVIS s.r.o.