Standard IEC 60749-8-ed.1.0 30.8.2002 preview

IEC 60749-8-ed.1.0

Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing



STANDARD published on 30.8.2002


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The information about the standard:

Designation standards: IEC 60749-8-ed.1.0
Publication date standards: 30.8.2002
SKU: NS-411424
The number of pages: 31
Approximate weight : 93 g (0.21 lbs)
Country: International technical standard
Category: Technical standards IEC

The category - similar standards:

Semiconductor devices in general

Annotation of standard text IEC 60749-8-ed.1.0 :

Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices. The contents of the corrigenda of April 2003 and August 2003 have been included in this copy. Applicable aux dispositifs a semiconducteurs (dispo-sitifs discrets et circuits integres), determine le taux de fuite des dispositifs a semiconducteurs. Le contenu des corrigenda davril 2003 et daout 2003 a ete pris en consideration dans cet exemplaire.

These corrections apply to this standard:

IEC 60749-8-ed.1.0/Cor.1 Correction

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
(Corrigendum 1 - Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 8: Etancheite)

Correction published on 23.4.2003

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IEC 60749-8-ed.1.0/Cor.2 Correction

Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
(Corrigendum 2 - Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 8: Etancheite)

Correction published on 12.8.2003

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