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IEC 60749-9-ed.2.0
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
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STANDARD published on 3.3.2017
The information about the standard:
Designation standards: IEC 60749-9-ed.2.0
Publication date standards: 3.3.2017
SKU: NS-677383
The number of pages: 9
Approximate weight : 27 g (0.06 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60749-9-ed.2.0 :
IEC 60749-9:2017 is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process. This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test. This edition includes the following significant technical changes with respect to the previous edition: a) revision to Clause 4 Equipment by a complete rewriting of Clause 3 Terms and definitions; b) additional variant – ‘adhesive tape pull test’. L’IEC 60749-9:2017 a pour objet de verifier que les marquages sur les dispositifs a semiconducteurs restent lisibles lorsqu’ils sont soumis au collage et au decollage d’etiquettes, ou a l’utilisation de solvants et de solutions de nettoyage habituellement destines a eliminer les residus de flux de soudage, lors du procede d’assemblage des cartes a circuits imprimes. Cet essai s’applique a tous les types de boitiers. Il convient pour les essais de qualification et/ou de controle de procede. Cet essai est considere comme non destructif. Les rejets issus d’essais electriques ou mecaniques peuvent etre utilises pour les besoins de cet essai.AnchorAnchor Cette edition inclut les modifications techniques majeures suivantes par rapport a l’edition precedente: a) revision de l’Article 4, Equipement, decoulant d’une refonte complete de l’Article 3, Termes et definitions; b) ajout d’un essai en variante, « essai a la bande adhesive ».
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