Standard IEC 60917-1-ed.2.0 13.9.2019 preview

IEC 60917-1-ed.2.0

Modular order for the development of mechanical structures for electrical and electronic equipment practices - Part 1: Generic standard

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STANDARD published on 13.9.2019


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The information about the standard:

Designation standards: IEC 60917-1-ed.2.0
Publication date standards: 13.9.2019
SKU: NS-970097
The number of pages: 56
Approximate weight : 168 g (0.37 lbs)
Country: International technical standard
Category: Technical standards IEC

The category - similar standards:

Mechanical structures for electronic equipment

Annotation of standard text IEC 60917-1-ed.2.0 :

IEC 60917-1:2019 is available as IEC 60917-1:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 60917-1:2019 specifies the relationships between equipment practices and the modular order which are applicable to the main structural dimensions of electronic and electrical equipment mounted in various installations where dimensional interfaces have to be considered for mechanical compatibility. This document also established terms for parts and assemblies of mechanical structures for electrical and electronic equipment, to clarify the specific relations between equipment practices and modular order. This second edition cancels and replaces the first edition published in 1998 and its Amendment 1:2000. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) added information on newly developed detail specification standards of mechanical structures for the electrical and electronic equipment practices; b) added information on newly developed performance test standards for the verifications of environmental performances and safety aspects and issues of the thermal performance and thermal management for the electrical and electronic equipment practices; c) introduced the relations between the mechanical structure for electrical and electronic system, the verification of environmental performance and safety aspects and issues of the thermal performance and thermal management for the electrical and electronic equipment practices. Key words: IT Cabinets, Mechanical Structures IEC 60917-1:2019 est disponible sous forme de IEC 60917-1:2019 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis ledition precedente. LIEC 60917-1:2019 specifie les relations entre les infrastructures et l’ordre modulaire qui sont applicables aux dimensions structurelles principales de l’equipement electronique et electrique monte au sein de diverses installations ou des interfaces dimensionnelles doivent etre considerees pour une compatibilite mecanique. Le present document etablit egalement les termes pour les composants et les ensembles des structures mecaniques pour l’equipement electrique et electronique, afin de clarifier les relations specifiques entre les infrastructures et l’ordre modulaire. Cette deuxieme edition annule et remplace la premiere edition publiee en 1998, ainsi que son Amendement 1:2000. Cette edition constitue une revision technique. Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: a) informations ajoutees sur les nouvelles normes de specification particuliere de structures mecaniques pour les infrastructures electroniques et electriques; b) informations ajoutees sur les nouvelles normes d’essai de performances destinees a la verification des performances environnementales, les aspects de la securite et le sujet des performances thermiques et de la gestion thermique pour les infrastructures electroniques et electriques; c) introduction des relations entre la structure mecanique pour les systemes electriques et electroniques, la verification des performances environnementales, les aspects de la securite et le sujet des performances thermiques et de la gestion thermique pour les infrastructures electroniques et electriques. Mots-cles: Baies, Structures mecaniques

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