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IEC 61188-5-2-ed.1.0
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
STANDARD published on 24.6.2003
The information about the standard:
Designation standards: IEC 61188-5-2-ed.1.0
Publication date standards: 24.6.2003
SKU: NS-412697
The number of pages: 103
Approximate weight : 340 g (0.75 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 61188-5-2-ed.1.0 :
Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints. Donne des informations sur la geometrie des zones de report, en vue du soudage par refusion des divers composants discrets. Fournit les dimensions, formes et tolerances appropriees des zones de report pour montage en surface afin dassurer une surface suffisante pour le cordon de brasure et pour permettre linspection, les essais et les retouches des joints de brasure.
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