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IEC 61188-5-4-ed.1.0
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
STANDARD published on 30.10.2007
The information about the standard:
Designation standards: IEC 61188-5-4-ed.1.0
Publication date standards: 30.10.2007
SKU: NS-412699
The number of pages: 29
Approximate weight : 87 g (0.19 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 61188-5-4-ed.1.0 :
IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions. La CEI 61188-5-4:2007 fournit les dimensions des composants et des plages daccueil des circuits integres a faible encombrement ayant des soties en J sur les deux cotes (composants SOJ) utilises dans le procede de brasage par fusion. La construction de base des systemes SOJ est egalement couverte. Larticle 4 enumere les tolerances et les dimensions de reference des joints de brasure utilises pour parvenir aux dimensions des plages daccueil.
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