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IEC 61188-5-6-ed.1.0
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
STANDARD published on 23.1.2003
The information about the standard:
Designation standards: IEC 61188-5-6-ed.1.0
Publication date standards: 23.1.2003
SKU: NS-412701
The number of pages: 37
Approximate weight : 111 g (0.24 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 61188-5-6-ed.1.0 :
Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints. Donne des informations sur les geometries de zones de report utilisees pour la fixation des composants electroniques avec des sorties en J sur les quatre cotes. Fournit les dimensions, les formes et les tolerances appropriees des zones de report de montage en surface afin de garantir une surface suffisante au raccord de brasure approprie et permet egalement linspection, les essais et les retouches des joints de brasure.
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