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IEC 61188-5-8-ed.1.0
Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
STANDARD published on 30.10.2007
The information about the standard:
Designation standards: IEC 61188-5-8-ed.1.0
Publication date standards: 30.10.2007
SKU: NS-412702
The number of pages: 61
Approximate weight : 183 g (0.40 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 61188-5-8-ed.1.0 :
IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints. This publication is to be read in conjunction with IEC 61188-5-1:2002. La CEI 61188-5-8:2007 fournit des informations sur la geometrie des plages daccueil utilisees pour la fixation en surface des composants electroniques a sorties matricielles de forme de boules de brasure, de colonnes de brasure ou de pastilles recouvertes dune protection. Le but des informations indiquees dans la presente norme est de fournir les dimensions, formes et tolerances appropriees des plages daccueil pour montage en surface afin de garantir une surface suffisante pour le raccord de brasure et pour permettre linspection, la mise en essai et les retouches des joints de brasure. Cette publication doit etre lue conjointement avec la CEI 61188-5-1:2002.
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