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IEC 61188-6-1-ed.1.0
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
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STANDARD published on 23.2.2021
The information about the standard:
Designation standards: IEC 61188-6-1-ed.1.0
Publication date standards: 23.2.2021
SKU: NS-1018729
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 61188-6-1-ed.1.0 :
IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4. L’IEC 61188-6-1:2021 specifie les exigences relatives aux surfaces de brasage sur les cartes imprimees. Cela comprend les pastilles et la zone de report des composants montes en surface, ainsi que les configurations des trous de brasage des composants montes par trous traversants. Ces exigences se fondent sur les exigences relatives au joint de brasure de l’IEC 61191-1, l’IEC 61191-2, l’IEC 61191-3 et l’IEC 61191-4.
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