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IEC 61189-1-ed.1.0
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
STANDARD published on 27.3.1997
The information about the standard:
Designation standards: IEC 61189-1-ed.1.0
Publication date standards: 27.3.1997
SKU: NS-412705
The number of pages: 37
Approximate weight : 111 g (0.24 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 61189-1-ed.1.0 :
This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies. Cette serie porte sur les methodes dessais applicables aux cartes imprimees et equipees ainsi que sur la robustesse des materiaux et des composants employes sans tenir compte de leur mode de fabrication. Cette partie comporte des methodes dessai applicables aux materiaux utilises pour constituer des structures dinterconnexion (cartes imprimees) et des ensembles electroniques. Ces methodes sont decrites de telle sorte que luniformite et la reproductibilite des procedures et des methodologies dessai soient assurees.
These changes apply to this standard:
IEC 61189-1-ed.1.0/Amd.1
Change
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Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
(Amendement 1 - Methodes d´essais pour les materiaux electriques, les structures d´interconnexion et les ensembles - Partie 1: Methodes d´essai generales et methodologie)
Change published on 9.8.2001
Selected format:Show all technical information.
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