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IEC 61189-2-808-ed.1.0
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
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STANDARD published on 25.4.2024
The information about the standard:
Designation standards: IEC 61189-2-808-ed.1.0
Publication date standards: 25.4.2024
SKU: NS-1182409
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 61189-2-808-ed.1.0 :
IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink. NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A. L’IEC 61189-2-808:2024 decrit la methode du transitoire thermique pour caracteriser la resistance thermique dun assemblage constitue dune source de chaleur (par exemple, un dispositif de puissance), dun materiau de fixation (par exemple, une brasure) et dune couche dielectrique avec electrode. Cette methode permet de determiner la resistance thermique des materiaux et des methodes dassemblage ainsi que doptimiser le flux thermique vers un dissipateur thermique. NOTE: Cette methode n’est toutefois pas destinee a mesurer et a specifier la valeur de la resistance thermique dun materiau dielectrique. Il existe d’autres normes a cet effet. Des exemples sont donnes a lAnnexe A.
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