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IEC 61189-3-719-ed.1.0
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
STANDARD published on 5.1.2016
The information about the standard:
Designation standards: IEC 61189-3-719-ed.1.0
Publication date standards: 5.1.2016
SKU: NS-625037
The number of pages: 22
Approximate weight : 66 g (0.15 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 61189-3-719-ed.1.0 :
IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling. LIEC 61189-3-719:2016 specifie une methode dessai pour controler la resistance des trous metallises uniques (PTH) dans les cartes de circuits imprimes (PCB), afin de determiner la durabilite des PTH sous contrainte thermomecanique induite par les cycles de temperatures.
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