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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
STANDARD published on 9.10.2007
Designation standards: IEC 61189-3-ed.2.0
Publication date standards: 9.10.2007
SKU: NS-412710
The number of pages: 241
Approximate weight : 754 g (1.66 lbs)
Country: International technical standard
Category: Technical standards IEC
IEC 61189-3:2007 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major technical changes with regard to the previous edition concern the addition of 25 new tests, as follows: - 6 V: Visual test methods: 3V01, 3V02 and 3V03; - 7 D: Dimensional test methods: 3D03; - 8 C: Chemical test methods: 3C02, 3C13 and 3C14; - 9 M: Mechanical test methods: 3M01, 3M03, 3M04, 3M07 and 3M09; - 10 E: Electrical test methods: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 and 3E18; - 11 N: Environmental test methods: 3N03, 3N07 and 3N12; - 12 X: Miscellaneous test methods: 3X01. La CEI 61189-3:2007 constitue un recueil de methodes dessai representant les methodologies et les modes operatoires qui peuvent etre appliques pour soumettre a essais les materiaux utilises pour fabriquer des structures dinterconnexion (cartes imprimees) et des ensembles. Les modifications techniques majeures par rapport a ledition precedente concernent lajout de 25 nouveaux essais, comme suit: - 6 V: Methodes dessais visuels: 3V01, 3V02 et 3V03; - 7 D: Methodes dessais dimensionnels: 3D03; - 8 C: Methodes dessais chimiques: 3C02, 3C13 et 3C14; - 9 M: Methodes dessais mecaniques: 3M01, 3M03, 3M04, 3M07 et 3M09; - 10 E: Methodes dessais electriques: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 et 3E18; - 11 N: Methodes dessais denvironnement: 3N03, 3N07 et 3N12; - 12 X: Methodes dessais divers: 3X01.
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