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IEC 61189-5-301-ed.1.0
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
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STANDARD published on 17.3.2021
The information about the standard:
Designation standards: IEC 61189-5-301-ed.1.0
Publication date standards: 17.3.2021
SKU: NS-1021097
The number of pages: 64
Approximate weight : 192 g (0.42 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 61189-5-301-ed.1.0 :
IEC 61189-5-301:2021 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste). This document is applicable to the solder paste using fine solder particle such as type 6, type 7 specified in IEC 61190-1-2 or finer particle sizes. This type of solder paste is used for connecting wiring and components in high-density printed circuit boards which are used in electronic or communication equipment and such, equipping fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 µm or less). Test methods for the characteristics of solder paste in this document are considering the effect of surface activation force due to the fine sized solder particles which could affect the test result by existing test methods. LIEC 61189-5-301:2021 specifie les methodes pour soumettre a essai les caracteristiques de la pate a braser a fines particules de brasage (ci-apres designee pate a braser). Le present document s’applique a la pate a braser a fines particules de brasage, telle que le type 6 et le type 7 specifies dans l’IEC 61190-1-2, ou a une pate a braser a particules plus fines. Ce type de pate a braser est utilise pour connecter des cablages et composants sur des cartes imprimees a haute densite employees dans les equipements electroniques ou de communication ou tout appareillage similaire equipe de cablage fin (par exemple des largeurs minimales de conducteurs et des espaces minimaux entre conducteurs de 60 µm ou moins). Les methodes d’essai pour les caracteristiques de la pate a braser presentees dans le present document tiennent compte de la force d’activation de la surface due a la finesse des particules de brasage qui peut affecter les resultats d’essais effectues selon les methodes existantes.
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