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IEC 61190-1-2-ed.3.0
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
STANDARD published on 19.2.2014
The information about the standard:
Designation standards: IEC 61190-1-2-ed.3.0
Publication date standards: 19.2.2014
SKU: NS-412717
The number of pages: 46
Approximate weight : 138 g (0.30 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 61190-1-2-ed.3.0 :
IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the materials performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition: a) modification of the solder powder size in Table 2; b) addition of the information of "Reflow condition and profile" in Annex B; c) addition of a new Annex C. IEC 61190-1-2:2014-02(en-fr) specifie les exigences dordre general relatives a la caracterisation et a lessai des pates a braser utilisees pour obtenir des interconnexions electroniques de haute qualite dans lassemblage de composants electroniques. La presente norme sert de document de controle de la qualite et na pas pour objet de sinteresser directement a la performance du materiau au cours du procede de fabrication. Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: a) modification des dimensions granulometriques de la poudre a braser dans le Tableau 2; b) ajout dinformations relatives a la "Condition et profil de refusion" en Annexe B; c) ajout dune nouvelle Annexe C.
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