Cookies
We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
IEC 61191-1-ed.3.0
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Translate name
STANDARD published on 14.9.2018
The information about the standard:
Designation standards: IEC 61191-1-ed.3.0
Publication date standards: 14.9.2018
SKU: NS-898887
The number of pages: 89
Approximate weight : 298 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Electronic component assembliesMechanical structures for electronic equipment
Annotation of standard text IEC 61191-1-ed.3.0 :
IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition: - the requirements have been updated to be compliant with the acceptance criteria in IPC-A-610F; - the term "assembly drawing" has been changed to "assembly documentation" throughout; - references to IEC standards have been corrected; - Clause 9 was completely rewritten; - Annex B was removed because there are already procedures for circuit board assemblies. L’IEC 61191-1:2018 etablit les exigences relatives aux materiaux, methodes et criteres de verification utilises dans le cadre de la production d’interconnexions et d’ensembles brases de qualite faisant appel a la technique de montage en surface ainsi qu’a des techniques d’assemblage associees. La presente partie de l’IEC 61191 comprend egalement des recommandations concernant la qualite des processus de fabrication. Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: - les exigences ont ete mises a jour pour etre conformes aux criteres d’acceptation de l’IPC-A-610F; - le terme "dessin d’assemblage" a ete remplace partout par "document d’assemblage"; - les references aux normes IEC ont ete corrigees; - l’Article 9 a ete entierement reecrit; - l’Annexe B a ete retiree car des procedures d’assemblages de cartes a circuits existent deja.
We recommend:
Technical standards updating
Do you want to make sure you use only the valid technical standards?
We can offer you a solution which will provide you a monthly overview concerning the updating of standards which you use.
Would you like to know more? Look at this page.
