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IEC 61191-1-ed.3.0-RLV
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Translate name
STANDARD published on 14.9.2018
The information about the standard:
Designation standards: IEC 61191-1-ed.3.0-RLV
Publication date standards: 14.9.2018
SKU: NS-1095413
The number of pages: 140
Approximate weight : 451 g (0.99 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Electronic component assembliesMechanical structures for electronic equipment
Annotation of standard text IEC 61191-1-ed.3.0-RLV :
IEC 61191-1:2018 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition: - the requirements have been updated to be compliant with the acceptance criteria in IPC-A-610F; - the term "assembly drawing" has been changed to "assembly documentation" throughout; - references to IEC standards have been corrected; - Clause 9 was completely rewritten; - Annex B was removed because there are already procedures for circuit board assemblies.
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