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IEC 61191-3-ed.2.0
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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STANDARD published on 30.5.2017
The information about the standard:
Designation standards: IEC 61191-3-ed.2.0
Publication date standards: 30.5.2017
SKU: NS-684306
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 61191-3-ed.2.0 :
IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting). This edition includes the following significant technical changes with respect to the previous edition: a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F. L’IEC 61191-3:2017 decrit les exigences relatives aux ensembles de composants a trous traversants (broches et trous) montes par brasage. Les exigences s’appliquent aux ensembles utilisant totalement une technique de montage par trous traversants (THT) ou aux portions THT d’ensembles incluant d’autres techniques associees (par exemple montage en surface, montage a puce, montage a borne). Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: a) mise a jour des exigences pour qu’elles soient conformes aux criteres d’acceptation de l’IPC-A-610F.
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