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IEC 61760-2-ed.3.0
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
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STANDARD published on 16.7.2021
The information about the standard:
Designation standards: IEC 61760-2-ed.3.0
Publication date standards: 16.7.2021
SKU: NS-1030828
The number of pages: 29
Approximate weight : 87 g (0.19 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 61760-2-ed.3.0 :
IEC 61760-2:2021 specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". Cross-references for references from this edition 3 to the previous edition 2 of this document are listed in Annex X of this document. LIEC 61760-2:2021 specifie les conditions de transport et de stockage qui sont prises en compte afin de permettre la mise en ouvre sans probleme des composants pour montage en surface (CMS), tant actifs que passifs. (Les conditions pour les cartes a circuits imprimes ne sont pas prises en compte.) L’objet du present document est de s’assurer que l’utilisateur de composants pour montage en surface recoit et emmagasine des produits qui pourront etre utilises (par exemple places, brases) sans probleme de qualite et de fiabilite. Des conditions de transport et de stockage impropres peuvent provoquer une deterioration des CMS et il en resulte des problemes d’assemblage tels qu’une mauvaise brasabilite, la separation des couches metallisees des terminaisons et l’effet "pop-corn". Les references croisees donnant les equivalences entre la presente edition 3 et l’edition 2 du present document sont enumerees a l’Annexe X du present document.
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