Cookies
We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
IEC 61760-3-ed.2.0
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
Translate name
STANDARD published on 3.2.2021
The information about the standard:
Designation standards: IEC 61760-3-ed.2.0
Publication date standards: 3.2.2021
SKU: NS-1017501
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 61760-3-ed.2.0 :
IEC 61760-3:2021 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology. The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that need to be part of any component generic, sectional or detail specification, when through-hole reflow soldering is intended. Furthermore, this document provides component users and manufacturers with a reference set of typical process conditions used in through-hole reflow soldering technology. This edition includes the following significant technical changes with respect to the previous edition: a) change position tolerance requirement (0,4 mm maximum to between 0,2 mm and 0,4 mm); b) introduce through-hole vacant method as a solder paste supply method. L’IEC 61760-3:2021 fournit un referentiel d’exigences et definit les conditions de procede ainsi que les conditions d’essai correspondantes a utiliser pour elaborer les specifications des composants electroniques destines a etre employes avec la technique du brasage par refusion a trous traversants (THR). L’objet du present document est de s’assurer que les composants equipes de sorties destinees a la THR et les composants pour montage en surface peuvent etre soumis aux memes procedes de placement et de montage. Ici, le present document definit les essais et les exigences faisant necessairement partie de toute specification generique, intermediaire ou particuliere de composant, lorsqu’il s’agit de brasage par refusion a trous traversants. De plus, le present document fournit aux utilisateurs de composants et a leurs fabricants un referentiel des conditions de procedes typiques utilisees dans le cadre de la technologie du brasage par refusion a trous traversants. Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: a) modification de l’exigence relative a la tolerance de position (0,4 mm au maximum et entre 0,2 mm et 0,4 mm); b) introduction de la methode du trou traversant vide comme methode d’application de pate a braser.
We recommend:
Technical standards updating
Do you want to make sure you use only the valid technical standards?
We can offer you a solution which will provide you a monthly overview concerning the updating of standards which you use.
Would you like to know more? Look at this page.
