Standard IEC 61788-27-ed.1.0 25.2.2025 preview

IEC 61788-27-ed.1.0

Superconductivity - Part 27: Twist pitch measurement of practical superconducting wires - Twist pitch measurement of Nb-Ti/Cu and Nb-Sn/Cu composite superconductors

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STANDARD published on 25.2.2025


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The information about the standard:

Designation standards: IEC 61788-27-ed.1.0
Publication date standards: 25.2.2025
SKU: NS-1214913
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC

The category - similar standards:

Conducting materials

Annotation of standard text IEC 61788-27-ed.1.0 :

IEC 61788-27:2025 specifies a test method for the twist pitch measurement of Nb-Ti/Cu and Nb-Sn/Cu composite superconductors by an untwisting method. The test method is applicable to Nb-Ti/Cu and Nb-Sn/Cu composite superconducting wires with monolithic structures, which have either a round cross section with a diameter ranging from 0,2 mm to 2 mm or a rectangular cross section that is equivalent in area to the round cross-sectional wires. These wires possess a filament diameter ranging from 6 µm to 200 µm, a twist pitch between 5 mm and 50 mm, and a matrix of copper or copper alloy. This document uses nitric acid to remove the matrix (copper or copper alloy), so the surface of the composite superconducting wire can be plated with a material that is dissolvable by nitric acid. Though uncertainty can increase, the method can apply to Nb-Ti/Cu or Nb-Sn/Cu composite superconducting wires when the parameters of cross-sectional area, filament diameter and twist pitch are out of the limit. The test method specified in this document is expected to apply to other types of composite superconducting wires after some appropriate modifications. LIEC 61788-27:2025 specifie une methode dessai pour le mesurage du pas de torsade des composites supraconducteurs Nb-Ti et Nb-Sn/Cu par une methode de detorsadage. La methode dessai sapplique aux fils supraconducteurs composites Nb-Ti/Cu et Nb-Sn/Cu a structure monolithique, de section ronde dun diametre compris entre 0,2 mm et 2 mm ou de section rectangulaire dont la surface est equivalente a celle des fils a section ronde. Ces fils possedent un diametre de filament compris entre 6 µm et 200 µm, un pas de torsade compris entre 5 mm et 50 mm, et une matrice de cuivre ou dalliage de cuivre. Le present document utilise lacide nitrique pour eliminer la matrice (cuivre ou alliage de cuivre), de sorte que la surface du fil supraconducteur composite puisse etre revetue dun materiau dissoluble par lacide nitrique. Meme si lincertitude peut augmenter, la methode peut sappliquer aux fils supraconducteurs composites Nb-Ti/Cu ou Nb-Sn/Cu lorsque les parametres de section, de diametre de filament et de pas de torsade sont en dehors des limites. Il est prevu que la methode dessai specifiee dans le present document sapplique a dautres types de fils supraconducteurs composites apres quelques modifications appropriees.

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