Standard IEC 61837-4-ed.2.0 27.3.2015 preview

IEC 61837-4-ed.2.0

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 4: Hybrid enclosure outlines



STANDARD published on 27.3.2015


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The information about the standard:

Designation standards: IEC 61837-4-ed.2.0
Publication date standards: 27.3.2015
SKU: NS-583728
The number of pages: 25
Approximate weight : 75 g (0.17 lbs)
Country: International technical standard
Category: Technical standards IEC

The category - similar standards:

Piezoelectric and dielectric devices

Annotation of standard text IEC 61837-4-ed.2.0 :

IEC 61837-4:2015 specifies the outline drawings and terminal lead connections for surface piezoelectric devices with hybrid enclosure outlines and is based on IEC 61240:2012 which standardized layout rules of outline drawings of surface-mounted device. This edition includes the following significant technical changes with respect to the previous edition: - Outline drawing is defined as one set of drawings consisting of four views, which are the view from above, the front view, the view from the right, and the view from below, instead of one set consisting of three views as provided in the previous edition. - The configurations of the enclosures were revised as shown in Table 1. This publication is to be read in conjunction with IEC 61240:2012. LIEC 61837-4:2015 specifie les dessins dencombrement et les connexions des sorties pour les dispositifs piezoelectriques a montage en surface avec les encombrements denveloppes hybrides, et est fondee sur lIEC 61240:2012, qui a normalise les regles de trace des dessins dencombrement des dispositifs a montage en surface. Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: - Le dessin dencombrement est defini comme un ensemble de dessins compose de quatre vues, a savoir la vue de dessus, la vue de face, la vue de droite et la vue de dessous, a la place de lensemble des trois vues prevu dans la version precedente. - Les configurations des enveloppes ont ete revisees comme indique au Tableau 1. Cette publication doit etre lue conjointement avec la CEI 61240:2012.

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