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IEC 62047-26-ed.1.0
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
STANDARD published on 7.1.2016
The information about the standard:
Designation standards: IEC 62047-26-ed.1.0
Publication date standards: 7.1.2016
SKU: NS-625046
The number of pages: 57
Approximate weight : 171 g (0.38 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 62047-26-ed.1.0 :
IEC 62047-26:2016 specifies descriptions of trench structure and needle structure in a micrometer scale. In addition, it provides examples of measurement for the geometry of both structures. For trench structures, this standard applies to structures with a depth of 1 µm to 100 µm; walls and trenches with respective widths of 5 µm to 150 µm; and aspect ratio of 0,006 7 to 20. For needle structures, the standard applies to structures with three or four faces with a height, horizontal width and vertical width of 2 µm or larger, and with dimensions that fit inside a cube with sides of 100 µm. This standard is applicable to the structural design of MEMS and geometrical evaluation after MEMS processes. LIEC 62047-26:2016 specifie des descriptions de structures de tranchees et de structures daiguille a lechelle micrometrique. En outre, elle donne des exemples de mesures de la geometrie des deux structures. Pour les structures de tranchees, la presente norme sapplique a des structures de profondeur comprise entre 1 µm et 100 µm, avec des parois et des tranchees de largeur comprise entre 5 µm et 150 µm et avec un rapport hauteur/largeur compris entre 0,006 7 et 20. Pour les structures daiguille, la norme sapplique a des structures a trois ou quatre faces dont la hauteur, la largeur horizontale et la largeur verticale sont superieures ou egales a 2 µm, et dont les dimensions permettent de placer chaque structure dans un cube de 100 µm de cote. La presente norme sapplique a la conception structurelle de procedes MEMS et a leur appreciation geometrique.
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