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IEC 62047-43-ed.1.0
Semiconductor devices - Micro-electromechanical devices - Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
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STANDARD published on 19.3.2024
The information about the standard:
Designation standards: IEC 62047-43-ed.1.0
Publication date standards: 19.3.2024
SKU: NS-1169223
The number of pages: 18
Approximate weight : 54 g (0.12 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 62047-43-ed.1.0 :
IEC 62047-43:2024 specifies the test method of electrical characteristics after cyclic bending deformation for flexible electromechanical devices. These devices include passive micro components and active micro components on the flexible film or embedded in the flexible film. The desired in-plane dimensions of the device for the test method ranges typically from 1 mm to 300 mm and the thickness ranges from 10 µm to 1 mm, but these are not limiting values. The test method is so designed as to understand and further visualize the entire performance deterioration behaviour after cyclic bending deformation in a concept of 3D (P-S-N: Performance - Severity of bending - Number of cycles) plot over the loading space of severity of bending and number of repeated cycles. This document is essential to estimate safety margin over the operation period under a certain level of cyclic bending deformation and indispensable for reliable design of the product employing these devices.
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