IEC 62047-9-ed.1.0/Cor.1

Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

STANDARD published on 8.3.2012

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The information about the standard:

Designation standards: IEC 62047-9-ed.1.0/Cor.1
Note: Correction
Publication date standards: 8.3.2012
SKU: NS-414116
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC

The category - similar standards:

Other semiconductor devices

This change (correction) applies to this standard:

IEC 62047-9-ed.1.0

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
(Dispositifs a semiconducteurs - Dispositif microelectromecaniques - Partie 9: Mesure de la resistance de collage de deux plaquettes pour les MEMS)

Standard published on 13.7.2011

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