Standard IEC 62137-3-ed.1.0 8.11.2011 preview

IEC 62137-3-ed.1.0

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints



STANDARD published on 8.11.2011


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The information about the standard:

Designation standards: IEC 62137-3-ed.1.0
Publication date standards: 8.11.2011
SKU: NS-414238
The number of pages: 90
Approximate weight : 301 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC

The category - similar standards:

Electronic component assemblies

Annotation of standard text IEC 62137-3-ed.1.0 :

IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following: - no technical changes; - some editorial changes and corrections; - for the sake of convenience some constitutive changes. La CEI 62137-3:2011 presente la methodologie de choix dune methode dessai appropriee a un essai de fiabilite des joints brases de divers types et formes de dispositifs montes en surface (CMS), de dispositifs du type en reseau, de dispositifs a connexions filaires et de dispositifs du type a insertion de connexions, utilisant divers types dalliages de materiaux de soudure. Cette premiere edition annule et remplace la CEI/PAS 62137-3, publiee en 2008, et comporte des modifications editoriales. Les principales modifications par rapport au PAS sont les suivantes: - pas de modifications techniques; - des corrections et modifications editoriales; - un reagencement du document.

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