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IEC 62148-21-ed.2.0
Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
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STANDARD published on 22.4.2021
The information about the standard:
Designation standards: IEC 62148-21-ed.2.0
Publication date standards: 22.4.2021
SKU: NS-1023492
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 62148-21-ed.2.0 :
IEC 62148-21:2021 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages. This second edition cancels and replaces the first edition published in 2019. This edition constitutes a technical revision. This edition includes the following significant technical change with respect to the previous edition: specification of an electric guard band area around the optical terminal area, so as to allow applications with electric signals at higher symbol rates (e.g. 50 Gbaud and 100 Gbaud). IEC 62148-21:2021 presente les lignes directrices en matiere de conception de l’interface electrique destinee aux boitiers de circuits integres photoniques (PIC) utilisant des boitiers matriciels a billes et a pas fins en silicium (S-FBGA) et des boitiers matriciels a zone de contact plate et a pas fins en silicium (S-FLGA). Dans le present document, l’interface electrique destinee au boitier S-FBGA est presentee a titre informatif. L’objet du present document est de specifier de maniere adequate l’interface electrique des boitiers PIC composes d’emetteurs et de recepteurs optiques qui permettent l’interchangeabilite electrique et mecanique des boitiers PIC. Cette deuxieme edition annule et remplace la premiere edition parue en 2019. Cette edition constitue une revision technique. Cette edition inclut la modification technique majeure suivante par rapport a l’edition precedente: specification d’une zone de bande de garde electrique autour de la zone des bornes optiques, de facon a permettre les applications dont les signaux electriques presentent des debits de symboles superieurs (par exemple 50 Gbd et 100 Gbd).
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