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IEC 62769-103-1-ed.3.0-RLV
Field Device Integration (FDI)® - Part 103-1: Profiles - PROFIBUS
Translate name
STANDARD published on 17.4.2023
The information about the standard:
Designation standards: IEC 62769-103-1-ed.3.0-RLV
Publication date standards: 17.4.2023
SKU: NS-1138884
The number of pages: 102
Approximate weight : 337 g (0.74 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Industrial process measurement and controlMultilayer applications
Annotation of standard text IEC 62769-103-1-ed.3.0-RLV :
IEC 62769-103-1:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 62769-103-1:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784-1_CP 3/1 (PROFIBUS DP)[2] and IEC 61784-1_CP3/2 (PROFIBUS PA). [1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder. [2] PROFIBUS is the trade name of the non-profit consortium PROFIBUS & PROFINET International. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
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