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Standard IEC 62899-202-10-ed.1.0 16.8.2023 preview

IEC 62899-202-10-ed.1.0

Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer

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STANDARD published on 16.8.2023


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The information about the standard:

Designation standards: IEC 62899-202-10-ed.1.0
Publication date standards: 16.8.2023
SKU: NS-1152679
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC

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Insulating materials in generalPrinted circuits and boards

Annotation of standard text IEC 62899-202-10-ed.1.0 :

IEC 62899-202-10:2023 defines terminology and measurement methods for the resistance change of conductive ink layer(s) as a function of thermoplastic elongation. The method measures resistance changes in-situ or post-elongation. This document is applicable to thermoformable substrates with conductive ink layers. The thermoformable substrates can have printed graphic ink as well and cover insulation layers.

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