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Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test
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STANDARD published on 3.8.2023
Designation standards: IEC 62899-202-9-ed.1.0
Publication date standards: 3.8.2023
SKU: NS-1150373
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC
IEC 62899-202-9:2023 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.
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Latest update: 2025-05-12 (Number of items: 2 199 201)
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