Standard IEC 63287-3-ed.1.0 6.8.2026 preview

IEC 63287-3-ed.1.0

Semiconductor devices - Generic semiconductor qualification guidelines - Part 3: Guidelines for reliability qualification plans for power semiconductor module

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STANDARD published on 6.8.2026


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The information about the standard:

Designation standards: IEC 63287-3-ed.1.0
Publication date standards: 6.8.2026
SKU: NS-1279931
The number of pages: 35
Approximate weight : 105 g (0.23 lbs)
Country: International technical standard
Category: Technical standards IEC

The category - similar standards:

Semiconductor devices in general

Annotation of standard text IEC 63287-3-ed.1.0 :

IEC 63287-3:2026 specifies guidelines for a reliability qualification plan for power semiconductor modules to assure reliability targets over the entire product life. Power semiconductor modules with incorporated control circuits are excluded. Clamped packages that need external pressure for being mounted in a system are excluded, e.g. disc-type pressure pack devices. This document is not intended for medical, military, aeronautics and astronautics-related applications. NOTE Throughout the document, the term power semiconductor module refers to multichip semiconductor power modules as defined in IEC 60191-4. L’IEC 63287-3:2026 specifie des lignes directrices pour un plan de qualification de la fiabilite des modules a semiconducteurs de puissance, visant a definir des objectifs de fiabilite sur toute la duree de vie du produit. Les modules a semiconducteurs de puissance avec circuits de commande incorpores ne relevent pas du domaine d’application du present document. Les boitiers presses qui necessitent une pression externe pour etre montes dans un systeme ne relevent pas du domaine d’application du present document, par exemple les dispositifs a compression en forme de disque. Le present document n’est pas destine aux applications medicales, militaires, aeronautiques et astronautiques. NOTE Tout au long du present document, le terme module a semiconducteurs de puissance designe les modules a semiconducteurs de puissance multipuces tels quils sont definis en lIEC 60191-4.

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