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IEC 63378-3-ed.1.0
Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis
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STANDARD published on 6.5.2025
The information about the standard:
Designation standards: IEC 63378-3-ed.1.0
Publication date standards: 6.5.2025
SKU: NS-1220291
The number of pages: 29
Approximate weight : 87 g (0.19 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 63378-3-ed.1.0 :
IEC 63378-3:2025 specifies the thermal circuit network model of discrete (TO-243, TO-252 and TO-263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification. This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices. L’IEC 63378-3:2025 specifie le modele de reseau de circuits thermiques des boitiers discrets (TO-243, TO-252 et TO-263), qui est utilise dans l’analyse transitoire des dispositifs electroniques pour estimer avec precision les temperatures de jonction sans verification experimentale. Ce modele est destine a etre fabrique et fourni par les fournisseurs de semiconducteurs, et a etre utilise par les assembleurs de dispositifs electroniques.
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