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IEC 63378-6-ed.1.0
Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points
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STANDARD published on 4.2.2026
The information about the standard:
Designation standards: IEC 63378-6-ed.1.0
Publication date standards: 4.2.2026
SKU: NS-1260468
The number of pages: 29
Approximate weight : 87 g (0.19 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 63378-6-ed.1.0 :
IEC 63378-6:2026 specifies a thermal resistance and capacitance model for semiconductor packages. This model is named the digital transformation using thermal resistance and capacitance (DXRC) model. It predicts transient temperature at junction and measurement points. This document applies to semiconductor packages such as TO-252, TO-263, and HSOP. It supports single chip packages dissipated heat from single package surface. L’IEC 63378-6:2026 specifie un modele de resistance thermique et de capacite pour les boitiers de semiconducteurs. Ce modele est appele transformation numerique utilisant le modele de resistance et de capacite thermiques (DXRC, Digital transformation using thermal resistance and capacitance). Il predit la temperature transitoire aux points de jonction et de mesure. Le present document s’applique aux boitiers de semiconducteurs tels que TO-252, TO-263 et HSOP. Il prend en charge les boitiers monopuces dissipant la chaleur d’une seule surface du boitier.
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