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Standard IEC/TR 61760-3-1-ed.1.0 17.6.2022 preview

IEC/TR 61760-3-1-ed.1.0

Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method

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STANDARD published on 17.6.2022


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314.30 USD

The information about the standard:

Designation standards: IEC/TR 61760-3-1-ed.1.0
Publication date standards: 17.6.2022
SKU: NS-1066259
The number of pages: 26
Approximate weight : 78 g (0.17 lbs)
Country: International technical standard
Category: Technical standards IEC

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The category - similar standards:

Electronic component assemblies

Annotation of standard text IEC/TR 61760-3-1-ed.1.0 :

IEC TR 61760-3-1:2022(E) supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.

Latest update: 2026-01-16 (Number of items: 2 254 749)
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