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Standard IEC/TR 61760-5-1-ed.1.0 31.1.2024 preview

IEC/TR 61760-5-1-ed.1.0

Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components

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STANDARD published on 31.1.2024


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The information about the standard:

Designation standards: IEC/TR 61760-5-1-ed.1.0
Publication date standards: 31.1.2024
SKU: NS-1165306
The number of pages: 24
Approximate weight : 72 g (0.16 lbs)
Country: International technical standard
Category: Technical standards IEC

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The category - similar standards:

Electronic component assemblies

Annotation of standard text IEC/TR 61760-5-1-ed.1.0 :

IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the scope of this document.

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