Standard IEC/TR 62240-1-ed.2.0-RLV 13.3.2018 preview

IEC/TR 62240-1-ed.2.0-RLV

Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating

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STANDARD published on 13.3.2018


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The information about the standard:

Designation standards: IEC/TR 62240-1-ed.2.0-RLV
Publication date standards: 13.3.2018
SKU: NS-1091970
The number of pages: 113
Approximate weight : 370 g (0.82 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC/TR 62240-1-ed.2.0-RLV :

IEC TR 62240-1:2018 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC TR 62240-1:2018 is a technical report, which provides information when using semiconductor devices in wider temperature ranges than those specified by the device manufacturer. The uprating solutions described herein are considered exceptions, when no reasonable alternatives are available; otherwise devices are utilized within the manufacturers’ specifications. This document describes the methods and processes for implementing this special case of thermal uprating. All of the elements of these methods and processes employ existing, commonly used best engineering practices. No new or unique engineering knowledge is needed to follow these processes, only a rigorous application of the overall approach. The terms “uprating” and “thermal uprating” are being used increasingly in avionics industry discussions and meetings, and clear definitions are included in the present IEC Technical Report. They were coined as shorthand references to a special case of methods commonly used in selecting electronic components for circuit design. This new edition cancels and replaces the first edition published in 2013 and includes a revised wording for subclause 4.1 (Introduction to selection provisions) and the associated flowchart.

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