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Semiconductor die products - Part 7: XML schema for data exchange
STANDARD published on 23.8.2007
Designation standards: IEC/TR 62258-7-ed.1.0
Publication date standards: 23.8.2007
SKU: NS-407831
The number of pages: 26
Approximate weight : 78 g (0.17 lbs)
Country: International technical standard
Category: Technical standards IEC
This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4.
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Latest update: 2025-07-11 (Number of items: 2 208 012)
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