Standard IEC/TS 62132-9-ed.1.0 21.8.2014 preview

IEC/TS 62132-9-ed.1.0

Integrated circuits - Measurement of electromagnetic immunity - Part 9: Measurement of radiated immunity - Surface scan method



STANDARD published on 21.8.2014


Language
Format
AvailabilityIN STOCK
Price300.10 USD excl. VAT
300.10 USD

The information about the standard:

Designation standards: IEC/TS 62132-9-ed.1.0
Publication date standards: 21.8.2014
SKU: NS-408112
The number of pages: 56
Approximate weight : 168 g (0.37 lbs)
Country: International technical standard
Category: Technical standards IEC

The category - similar standards:

Integrated circuits. Microelectronics

Annotation of standard text IEC/TS 62132-9-ed.1.0 :

IEC TS 62132-9:2014 provides a test procedure, which defines a method for evaluating the effect of near electric, magnetic or electromagnetic field components on an integrated circuit (IC). This diagnostic procedure is intended for IC architectural analysis such as floor planning and power distribution optimization. This test procedure is applicable to testing an IC mounted on any circuit board that is accessible to the scanning probe. In some cases it is useful to scan not only the IC but also its environment. For comparison of surface scan immunity between different ICs, the standardized test board defined in IEC 62132-1 should be used. This measurement method provides a mapping of the sensitivity (immunity) to electric- or magnetic-near-field disturbance over the IC. The resolution of the test is determined by the capability of the test probe and the precision of the Probe-positioning system. This method is intended for use up to 6 GHz. Extending the upper limit of frequency is possible with existing probe technology but is beyond the scope of this specification. The tests described in this document are carried out in the frequency domain using continuous wave (CW), amplitude modulated (AM) or pulse modulated (PM) signals. LIEC TS 62132-9:2014 fournit une procedure dessai, qui definit une methode devaluation de leffet des composants de champs proches electriques, magnetiques ou electromagnetiques sur un circuit integre (CI). Cette procedure de diagnostic est destinee a lanalyse architecturale du CI telle que la gestion de couches et loptimisation de la distribution de puissance. Cette procedure dessai sapplique aux essais effectues sur un CI monte sur nimporte quelle carte de circuit a laquelle la sonde de balayage a acces. Il est dans certains cas utile de balayer lenvironnement en plus du CI. Pour la comparaison de limmunite de balayage en surface entre differents CI, il convient que la carte dessai normalisee definie dans lIEC 62132-1 soit utilisee. Cette methode de mesure fournit un mapping de la sensibilite (immunite) des perturbations de champs proches electriques ou magnetiques sur le CI. La resolution de lessai est determinee par laptitude de la sonde dessai et la precision du systeme de positionnement de la sonde. Cette methode est destinee a une utilisation jusqua 6 GHz. Lextension de la limite superieure de la frequence est possible avec la technologie actuelle en matiere de sondes, mais cela nentre pas dans le domaine dapplication de la presente specification. Les essais decrits dans ce document sont effectues dans le domaine de frequence avec des signaux en onde entretenue (CW, continuous wave), en amplitude modulee (AM, amplitude modulated) ou modulation par impulsion (PM, pulse modulated).

We recommend:

Updating of laws

Do you want to be sure about the validity of used regulations?
We offer you a solution so that you could use valid and updated legislative regulations.
Would you like to get more information? Look at this page.




Cookies Cookies

We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.

You can refuse consent here.

Here you can customize your cookie settings according to your preferences.

We need your consent to use the individual data so that you can see information about your interests, among other things.