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IEC/TS 62647-4-ed.1.0
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling
Translate name
STANDARD published on 10.4.2018
The information about the standard:
Designation standards: IEC/TS 62647-4-ed.1.0
Publication date standards: 10.4.2018
SKU: NS-845674
The number of pages: 41
Approximate weight : 123 g (0.27 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Production. Production managementElectronic components in generalAerospace electric equipment and systems
Annotation of standard text IEC/TS 62647-4-ed.1.0 :
IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. The intent of this document is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing and maintaining a new set of processes or the creation of a stand-alone re-balling process.
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