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IEEE/IEC 63055-2023
IEEE/IEC International Standard--Format for LSI-Package-Board Interoperable design
Translate name
STANDARD published on 19.10.2023
The information about the standard:
Designation standards: IEEE/IEC 63055-2023
Publication date standards: 19.10.2023
SKU: NS-1155988
The number of pages: 298
Approximate weight : 925 g (2.04 lbs)
Country: International technical standard
Category: Technical standards IEEE
Annotation of standard text IEEE/IEC 63055-2023 :
Adoption Standard - Active.
A method is provided for specifying a common interoperable format for electronic systems design. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in the large-scale integration-package-board designs. The method provides the ability to make electronic systems a key consideration early in the design process; design tools can use it to seamlessly exchange information/data.
ISBN: 979-8-8557-0216-3, 979-8-8557-0217-0
Number of Pages: 298
Product Code: STD26543, STDPD26543
Keywords: common interoperable format, components, design analysis, design rules, geometries, IEEE 2401™, large-scale integration (LSI), netlists, packages for LSI circuits, printed circuit board, project management, Verilog-HDL
Category: Design Automation
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